Products That Prime Has Marked

Prime Solutions can mark most semiconductor products.

We can process devices in JEDEC trays or products in plastic tubes. With our own custom tooling capabilities, we can arrange products in efficient arrays for cost effective processing.

Here’s a SAMPLE list of the package types we have processed:

Micro BGASOICPLCCQFNPBGA
Flip Chip SOJ LQFP LLP CPGA
Stacked CSP LCC BQFP LFCSP  
Flip Chip CSP TSOP I CQFP  
PBGA TSOP II QSOP  
TBGA Plastic DIP TQFP  
HCBGA Ceramic DIP MQFP  
FBGA TSSOP PQFP  
MSOP P-DIP  
  SSOP C-DIP  
  SOT SIPP  
  SC74 CERPAC  
  TO-XXX    
 AND VARIOUS OTHER PACKAGE TYPES.

In addition to electronic components, Prime has marked on various other materials for medical, aerospace, industrial, and consumer industries. Our in house Graphics capabilities has helped create necessary artworks for immediate use, and be able to program our manufacturing systems to generate the required ink or laser mark products.