Prime Solutions can mark most semiconductor products.
We can process devices in JEDEC trays or products in plastic tubes. With our own custom tooling capabilities, we can arrange products in efficient arrays for cost effective processing.
Here’s a SAMPLE list of the package types we have processed:
| Micro BGA | SOIC | PLCC | QFN | PBGA |
|---|---|---|---|---|
| Flip Chip | SOJ | LQFP | LLP | CPGA |
| Stacked CSP | LCC | BQFP | LFCSP | |
| Flip Chip CSP | TSOP I | CQFP | ||
| PBGA | TSOP II | QSOP | ||
| TBGA | Plastic DIP | TQFP | ||
| HCBGA | Ceramic DIP | MQFP | ||
| FBGA | TSSOP | PQFP | ||
| MSOP | P-DIP | |||
| SSOP | C-DIP | |||
| SOT | SIPP | |||
| SC74 | CERPAC | |||
| TO-XXX |
AND VARIOUS OTHER PACKAGE TYPES.
In addition to electronic components, Prime has marked on various other materials for medical, aerospace, industrial, and consumer industries. Our in house Graphics capabilities has helped create necessary artworks for immediate use, and be able to program our manufacturing systems to generate the required ink or laser mark products.