Bake and Dry Pack

Semiconductor devices can absorb moisture from the atmosphere which can lead to expansion problems when PCB’s are populated with components and heated for the soldering process. When this occurs, moisture trapped in the package wants to expand; this rapid expansion can cause internal cracking that leads to device reliability problems. Newer “lead free” solders melt at higher temperatures than solders that contain lead; these higher temperatures only exacerbate this problem.

We can bake devices in trays, or devices in tubes to rid them of moisture. All devices are then vacuum sealed with desiccant and humidity indicator cards and labeled with the seal date for tracking purposes. Prime Solutions complies with industry standards for vacuum sealing of semiconductor products, as well as to customer specifications as required.