Laser Marking • Ink Marking • Removal of Marks by Laser: Laser Demarking • Surface Reconditioning of Laser Marked Parts
Bake & Dry Pack • Cleaning Processes: Plasma Cleaning, Flame Treatment, Laser Ablation
Barcodes/2d Matrix codes/Serialization • Graphics Capabilities • Semiconductor Products Marked
Laser Marking
Laser marking is an alternative process for marking semiconductor products. typical applications are: to “add marks” to existing markings, serialization of products and removal of markings from products. Laser marking can be a lower cost alternative compared to ink marking and Laser Demarking provides another alternative to media “blast” mark removal.
Prime Solutions utilizes different lasers which allows marking of many materials. We have the ability to mark most current plastic semiconductor devices and the latest metal coatings on large scale BGA packages.
Our newest laser is the for marking on Silicon chip surfaces. The different frequency of this laser is utilized specifically for its absorption characteristics at the surface of silicon.
We choose the best laser process for the product and for the most efficient processing for your parts (see our New Technology page for more innovative uses of lasers).
Ink Marking
The primary process for marking plastic semiconductor packages is Pad Printing. Advancements in this technology over the last 15 years have made it a quality process that is cost effective for marking most semiconductor products. We select the best inks that will meet your requirements and combine these with the appropriate cleaning processes to yield superior results.
Removal of marks by laser: Laser Demarking
Prime Solutions has perfected the process of removing ink marks from Gold, Nickel and other metal surfaces.
One traditional mark removal process involves immersing the product in a highly alkaline solution with a PH of 12.5-14.5, under heat. Leads and solder ability can be affected in negative ways.
By utilizing lasers we eliminate the chemical process and immersion in liquids. Because lasers have precision controls we can direct the laser beam to effect only the actual mark area. Threshold energy levels remove the organic material and the characteristics of the Gold/Nickel allow the laser energy to be largely reflected from the metal surface.
Different lasers yield different results! Prime utilizes more than one laser technology to allow the best solution for many different materials. From the select removal of markings to uniform polishing of metal surfaces we can give your product a fresh new look.
For Laser Demarking of plastic products see our New Technology page where we combine Laser Demarking with Surface Reconditioning of plastic packages to achieve a new product surface.
Surface Reconditioning of Laser Marked parts
Have you ever had incorrectly marked parts or just wanted to change a single number? If so you should consider our reconditioning process.
First, we prepare the parts via our proven cleaning processes and then we coat the surfaces with a coating that is cured and meets most industry requirements. The coating is remarkably close to the original parts plastic appearance before it was lased. At this point you have the choice to remark the product via laser a second time or you can choose ink marking if required. If you do your own marking in house then “you” can remark the product and realize further benefits.
If you choose to laser remark then you will see a major contrast difference in the marking. The appearance will be more visible in many instances than the original mark.
Bake and Dry Pack
Semiconductor devices can absorb moisture from the atmosphere which can lead to expansion problems when populated PCBs are heated for the soldering process. When this occurs, moisture trapped in the package wants to expand; this rapid expansion can cause internal cracking that leads to device reliability problems. Newer “lead free” solders melt at higher temperatures than solders that contain lead; these higher temperatures only exacerbate this problem.
We can bake devices in trays, or devices in tubes to rid them of moisture. All devices are then vacuum sealed with dessicant and humidity indicator cards, and labeled with the seal date for tracking purposes. Prime Solutions complies with industry standards for vacuum sealing or customer specifications as required.
Cleaning Processes: Plasma Cleaning, Flame Treatment, Laser Ablation
Prime Solutions utilizes several different cleaning processes for the preparation of product prior to the application of inks or compounds.
Plasma Cleaning is used for preparing semiconductor products prior to ink marking. We also use plasma to clean contamination from leads, ball arrays and Gold and Nickel surfaces.
Flame treatment is another process utilized by Prime Solutions. It is widely accepted for in line processing of plastic semiconductor packages.
For really tough applications laser treatment of the product surface is possible and in combination with Plasma or Flame treatment this can insure the ultimate bonding of inks or coatings to many substrate materials.
Prime has the right combination of processes to meet the most stringent requirements for adhesion and performance.
Barcodes/2d Matrix codes/Serialization
Prime Solutions can help your company take advantage of the latest automation technology.
Tracking products with machine readable codes throughout the lifetime of the product creates high value. Through our laser processing we can create lasting machine readable code markings that withstand harsh environments on many different materials.
Typical codes:
| Code 39 Code 93 EAN/URC 128 UPC-A EAN-8 Booklan |
Code 39 Extended
Code 128 Interleaves 2/5 UPC-E EAN-13 Codabar |
Graphics Capabilities
Prime Solutions can use most artwork formats sent to us via Email, disk or hard copy. Your artwork can be in Mac or PC platform.
We can read a wide variety of graphic formats which typically include:
| EPSF PICT TIFF DXF |
BIT
PCX JPEG GIF |
We utilize the following software:
Adobe Illustrator
Deneba Cad
Corel Draw
Quark Express
Photoshop
Image Ready
Canvas
We can scan and convert your artwork for most printing applications. We will reproduce an accurate representation of your logos and Graphics.
Products that Prime has marked
Prime Solutions can mark most semiconductor products.
We can handle JEDEC trays and products in plastic tubes. In our own custom tooling we can arrange products in efficient arrays for cost effective processing.
Some of the products we have processed:
| Micro BGA Flip Chip Stacked CSP Flip Chip CSP PBGA TBGA PBGA |
SOIC SOJ TSOP I TSOP II Plastic DIP Ceramic DIP TSSOP |
PLCC |
| PQFP LQFP BQFP CQFP QSOP TQFP |
PGA TO-3 TO-5 TO-220 PGA |
Memory Modules |
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